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Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

1
College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
2
School of Materials Science and Engineering, Nanjing University of Science and Technology, Nanjing 210096, China
3
State Key Laboratory of Advanced Brazing Filler Metals and Technology, Zhengzhou Research Institute of Mechanical Engineering Co., Ltd., Zhengzhou 450002, China
*
Author to whom correspondence should be addressed.
Appl. Sci. 2019, 9(10), 2044; https://doi.org/10.3390/app9102044
Received: 12 April 2019 / Revised: 11 May 2019 / Accepted: 13 May 2019 / Published: 17 May 2019
(This article belongs to the Special Issue Nanotechnology for Novel Nanojoining and Microjoining)
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Abstract

With the development of microelectronic packaging and increasingly specific service environment of solder joints, much stricter requirements have been placed on the properties of lead-free solders. On account of small size effect and high surface energy, nanoparticles have been widely used to improve the microstructure and properties of lead-free solders. Therefore, the composite solders bearing nanoparticles have recently attracted wide attention. This article reviewed the recent research on SnAgCu, SnBi, and SnZn composite solder alloys and introduced the effect of nanoparticles on their microstructure, mechanical properties, wettability, and reliability. The mechanism of nanoparticles strengthening was analyzed and summarized. In addition, the shortcomings and future development trends of nanoparticle-reinforced lead-free solders were discussed, which is expected to provide some theoretical reference for the application of these composite solder in 3D IC package. View Full-Text
Keywords: nanoparticle; composite lead-free solder; microstructure; mechanical properties; wettability; reliability nanoparticle; composite lead-free solder; microstructure; mechanical properties; wettability; reliability
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Zhang, P.; Xue, S.; Wang, J.; Xue, P.; Zhong, S.; Long, W. Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review. Appl. Sci. 2019, 9, 2044.

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