Special Issue "Advanced Materials and Reliability for Microelectronics"
Deadline for manuscript submissions: 31 December 2021.
Interests: material and damage analytics
We invite you to submit contributions dealing with the design and fabrication of advanced materials for microelectronic applications, as well as the reliability of microelectronic devices and systems. From experimental techniques to data analysis, the scope of the Special Issue is to incorporate and combine topics such as the development and application of (1) experimental methods and methodological workflows for material research and reliability testing, (2) device technology, (3) computational modeling and simulations, as well as (4) advanced data analysis and embedded computing systems incorporating artificial intelligence (AI)-based concepts. The Special Issue shall in particular address industrial relevant research in the field of microelectronics.
Dr. Roland Brunner
Dr. Elke Kraker
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- artificial intelligence
- 3D integration
- thin films
- porous materials
- failure analysis
- assembly and interconnect technology
- functional materials
- nanostructure devices and device technology