Special Issue "Latest Advances of 5G for IoT and Automotive Scenarios"
Deadline for manuscript submissions: 31 July 2021.
Interests: Wireless Communications
Interests: automotive electronics; embedded HPC (high-performance computing); enabling technologies IoT (Internet of Things)
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The new technology revolution we are going through presently is certainly changing the way we live, work, and communicate with each other. In this context, the never-known-before growth of both the volume of mobile traffic and the number of connected devices paves the way for a new era in the communication world, mainly marked by the effort spent in the development of fifth-generation (5G) wireless systems. Highly ambitious goals in various scenarios are expected to be fulfilled by 5G devices, namely, multi-Gbps data rate, near-100% reliability, sub-ms latency, each of which matches the ITU services of enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), and ultra-reliable low-latency communication (URLLC). By virtue of the appealing 5G requirements for maintaining an every-time, everywhere, reliable, and large density network connectivity, a variety of new concepts are emerging in the area of Internet-of-Things (IoT) devices, smart manufacturing, and automotive communications, thus enabling a number of innovative services and applications.
The purpose of this Special Issue is to collect novel papers on the latest advances in 5G technology supporting next-generation IoT, smart manufacturing, and automotive communications, in order to provide a detailed understanding of the basic principles, state of the art, applications, future trends, and open issues. Hence, contributions from both academia and industry are invited on all the above 5G aspects concerning, but not limited to, topics such as:
- Transceiver and antenna design;
- Beamforming techniques, millimeter wave (mmW) communications combined with massive MIMO (mMIMO);
- Adaptive resource allocation;
- Cognitive, opportunistic, and cooperative radio;
- Latency, reliability, energy and spectrum efficiency, flexibility, connection density;
- Channel sounding, measurement, modeling, estimation;
- Reconfigurable intelligent surfaces;
- Network densification, optimization, planning;
- Cybersecurity issues;
- Machine learning techniques;
- Applications to automotive (V2X, ADAS) and smart manufacturing (D2D);
- High-performance platforms (FPGA, GPU, GPP, SoC) for baseband processing.
Prof. Dr. Vincenzo Lottici
Prof. Dr. Sergio Saponara
Dr. Alexandros-Apostolos A. Boulogeorgos
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- massive MIMO
- resource allocation
- cooperative radio
- energy and spectrum efficiency
- high-performance platforms