Ultrasonic Transducers in Next-Generation Application
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Acoustics and Vibrations".
Deadline for manuscript submissions: 20 December 2025 | Viewed by 17
Special Issue Editor
Interests: ultrasonic transducers; automotive semiconductor; sensor semiconductor
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Ultrasonic technology is used in sensing and communication with ultrasonic signals, and the range of its application is expanding further still with high-resolution capabilities. Ultrasonic transducers, which are devices that generate ultrasonic waves, are being applied in various fields such as medicine, the automotive industry, and for engineering sensors. Depending on the application, the technology is implemented in various ways—such as mechanical processes and semiconductor processes—and, structurally, it is made in various ways, depending on the shape, signal mode (e.g., piezoelectric or capacitive micromachined ultrasonic transducers—CMUTs), and number of arrays.
In this Special Issue, we invite all the original research and review papers to discuss next-generation ultrasonic transducer technology along with various recent developments related to the design, manufacture, materials, signal, interface electronics, platform, reliability, and applications of ultrasonic transducers.
Dr. Inn-Yeal Oh
Guest Editor
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Keywords
- sensor
- communication
- piezoelectric
- MEMS
- CMUT
- PMUT
- array
- beam focusing
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