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Journal: Micro, 2025
Volume: 5
Number: 23
23
Article: Development of Low-Dielectric Modified Polyimide with Low-Temperature Radical Curing for High-Frequency Flexible Printed Circuit Boards
Authors: by Seonwoo Kim, Suin Chae, Mirae Seo, Yubin Kim, Soobin Park, Sehoon Park and Hyunjin Nam
Link: https://www.mdpi.com/2673-8023/5/2/23

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