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Journal: Eng. Proc., 2021
Volume: 6
Number: 53
Article:
Failure Analysis of Wire Bonding on Strain Gauge Contact Pads Using FIB, SEM, and Elemental Mapping
Authors:
by
Muhammad Talal Asghar, Thomas Frank and Frank Schwierz
Link:
https://www.mdpi.com/2673-4591/6/1/53
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