Hegedüs, J.; Szabó, P.G.; Pohl, L.; Hantos, G.; Lipák, G.; Reolon, A.; Ender, F.
Thermal Characterization Methods of Novel Substrate Materials Utilized in IGBT Modules. Electron. Mater. 2025, 6, 9.
https://doi.org/10.3390/electronicmat6030009
AMA Style
Hegedüs J, Szabó PG, Pohl L, Hantos G, Lipák G, Reolon A, Ender F.
Thermal Characterization Methods of Novel Substrate Materials Utilized in IGBT Modules. Electronic Materials. 2025; 6(3):9.
https://doi.org/10.3390/electronicmat6030009
Chicago/Turabian Style
Hegedüs, János, Péter Gábor Szabó, László Pohl, Gusztáv Hantos, Gyula Lipák, Andrea Reolon, and Ferenc Ender.
2025. "Thermal Characterization Methods of Novel Substrate Materials Utilized in IGBT Modules" Electronic Materials 6, no. 3: 9.
https://doi.org/10.3390/electronicmat6030009
APA Style
Hegedüs, J., Szabó, P. G., Pohl, L., Hantos, G., Lipák, G., Reolon, A., & Ender, F.
(2025). Thermal Characterization Methods of Novel Substrate Materials Utilized in IGBT Modules. Electronic Materials, 6(3), 9.
https://doi.org/10.3390/electronicmat6030009