Ngo, M.C.; Miyazaki, H.; Hirao, K.; Ohji, T.; Fukushima, M.
Degradation Progress of Metallized Silicon Nitride Substrate Under Thermal Cycling Tests by Digital Image Correlation. J. Compos. Sci. 2025, 9, 536.
https://doi.org/10.3390/jcs9100536
AMA Style
Ngo MC, Miyazaki H, Hirao K, Ohji T, Fukushima M.
Degradation Progress of Metallized Silicon Nitride Substrate Under Thermal Cycling Tests by Digital Image Correlation. Journal of Composites Science. 2025; 9(10):536.
https://doi.org/10.3390/jcs9100536
Chicago/Turabian Style
Ngo, Minh Chu, Hiroyuki Miyazaki, Kiyoshi Hirao, Tatsuki Ohji, and Manabu Fukushima.
2025. "Degradation Progress of Metallized Silicon Nitride Substrate Under Thermal Cycling Tests by Digital Image Correlation" Journal of Composites Science 9, no. 10: 536.
https://doi.org/10.3390/jcs9100536
APA Style
Ngo, M. C., Miyazaki, H., Hirao, K., Ohji, T., & Fukushima, M.
(2025). Degradation Progress of Metallized Silicon Nitride Substrate Under Thermal Cycling Tests by Digital Image Correlation. Journal of Composites Science, 9(10), 536.
https://doi.org/10.3390/jcs9100536