Gao, Z.; Si, W.; Han, Z.; Peng, J.; Qiao, F.
Grouping Method of Semiconductor Bonding Equipment Based on Clustering by Fast Search and Find of Density Peaks for Dynamic Matching According to Processing Tasks. Processes 2019, 7, 566.
https://doi.org/10.3390/pr7090566
AMA Style
Gao Z, Si W, Han Z, Peng J, Qiao F.
Grouping Method of Semiconductor Bonding Equipment Based on Clustering by Fast Search and Find of Density Peaks for Dynamic Matching According to Processing Tasks. Processes. 2019; 7(9):566.
https://doi.org/10.3390/pr7090566
Chicago/Turabian Style
Gao, Zhijun, Wen Si, Zhonghua Han, Jiayu Peng, and Feng Qiao.
2019. "Grouping Method of Semiconductor Bonding Equipment Based on Clustering by Fast Search and Find of Density Peaks for Dynamic Matching According to Processing Tasks" Processes 7, no. 9: 566.
https://doi.org/10.3390/pr7090566
APA Style
Gao, Z., Si, W., Han, Z., Peng, J., & Qiao, F.
(2019). Grouping Method of Semiconductor Bonding Equipment Based on Clustering by Fast Search and Find of Density Peaks for Dynamic Matching According to Processing Tasks. Processes, 7(9), 566.
https://doi.org/10.3390/pr7090566