Next Article in Journal
Experimental Evaluation of Coupled-Line Tunable Inductors with Switchable Mutual Coupling
Previous Article in Journal
Suppression of Cohesive Cracking Mode Based on Anisotropic Porosity in Sintered Silver Die Attach Encapsulated by Epoxy Molding Compounds
 
 
Article

Article Versions Notes

Electronics 2025, 14(16), 3229; https://doi.org/10.3390/electronics14163229
Action Date Notes Link
article xml file uploaded 14 August 2025 12:11 CEST Original file -
article xml uploaded. 14 August 2025 12:11 CEST Update https://www.mdpi.com/2079-9292/14/16/3229/xml
article pdf uploaded. 14 August 2025 12:11 CEST Version of Record https://www.mdpi.com/2079-9292/14/16/3229/pdf
article html file updated 14 August 2025 12:14 CEST Original file -
article html file updated 28 August 2025 09:35 CEST Update -
article html file updated 15 September 2025 09:27 CEST Update -
article html file updated 24 September 2025 19:26 CEST Update https://www.mdpi.com/2079-9292/14/16/3229/html
Back to TopTop