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Journal: Electronics, 2024
Volume: 13
Number: 4176

Article: Mitigating Thermal Side-Channel Vulnerabilities in FPGA-Based SiP Systems Through Advanced Thermal Management and Security Integration Using Thermal Digital Twin (TDT) Technology
Authors: by Amrou Zyad Benelhaouare, Idir Mellal, Maroua Oumlaz and Ahmed Lakhssassi
Link: https://www.mdpi.com/2079-9292/13/21/4176

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