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Journal: ElectronicsVolume: 13Number: 4176
Article: Mitigating Thermal Side-Channel Vulnerabilities in FPGA-Based SiP Systems Through Advanced Thermal Management and Security Integration Using Thermal Digital Twin (TDT) Technology
- Authors:
- Amrou Zyad Benelhaouare*,
- Idir Mellal and
- Maroua Oumlaz
- et al.
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