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Journal: Electronics, 2024
Volume: 13
Number: 3544
3544
Article: Estimation of Void Area and Position in Solder Layer of Power Semiconductor Devices Based on Temperature Distribution Characteristics
Authors: by Wang Guo, Xingang Chen, Zheng Tang, Xingmou Liu, Zhipeng Ma, Xiangtao Xu and Daquan Xia
Link: https://www.mdpi.com/2079-9292/13/17/3544

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