Article Versions Notes

Guo W, Chen X, Tang Z, Liu X, Ma Z, Xu X, Xia D. Estimation of Void Area and Position in Solder Layer of Power Semiconductor Devices Based on Temperature Distribution Characteristics. Electronics. 2024; 13(17):3544. https://doi.org/10.3390/electronics13173544

Guo, Wang, Xingang Chen, Zheng Tang, Xingmou Liu, Zhipeng Ma, Xiangtao Xu, and Daquan Xia. 2024. "Estimation of Void Area and Position in Solder Layer of Power Semiconductor Devices Based on Temperature Distribution Characteristics" Electronics 13, no. 17: 3544. https://doi.org/10.3390/electronics13173544

Guo, W., Chen, X., Tang, Z., Liu, X., Ma, Z., Xu, X., & Xia, D. (2024). Estimation of Void Area and Position in Solder Layer of Power Semiconductor Devices Based on Temperature Distribution Characteristics. Electronics, 13(17), 3544. https://doi.org/10.3390/electronics13173544