Guo, W.; Chen, X.; Tang, Z.; Liu, X.; Ma, Z.; Xu, X.; Xia, D.
Estimation of Void Area and Position in Solder Layer of Power Semiconductor Devices Based on Temperature Distribution Characteristics. Electronics 2024, 13, 3544.
https://doi.org/10.3390/electronics13173544
AMA Style
Guo W, Chen X, Tang Z, Liu X, Ma Z, Xu X, Xia D.
Estimation of Void Area and Position in Solder Layer of Power Semiconductor Devices Based on Temperature Distribution Characteristics. Electronics. 2024; 13(17):3544.
https://doi.org/10.3390/electronics13173544
Chicago/Turabian Style
Guo, Wang, Xingang Chen, Zheng Tang, Xingmou Liu, Zhipeng Ma, Xiangtao Xu, and Daquan Xia.
2024. "Estimation of Void Area and Position in Solder Layer of Power Semiconductor Devices Based on Temperature Distribution Characteristics" Electronics 13, no. 17: 3544.
https://doi.org/10.3390/electronics13173544
APA Style
Guo, W., Chen, X., Tang, Z., Liu, X., Ma, Z., Xu, X., & Xia, D.
(2024). Estimation of Void Area and Position in Solder Layer of Power Semiconductor Devices Based on Temperature Distribution Characteristics. Electronics, 13(17), 3544.
https://doi.org/10.3390/electronics13173544
