Deng, L.; Li, T.; Wang, Z.; Zhang, P.; Wu, S.; Liu, J.; Zhang, J.; Chen, L.; Zhang, J.; Huang, W.;
et al. Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages. Electronics 2024, 13, 203.
https://doi.org/10.3390/electronics13010203
AMA Style
Deng L, Li T, Wang Z, Zhang P, Wu S, Liu J, Zhang J, Chen L, Zhang J, Huang W,
et al. Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages. Electronics. 2024; 13(1):203.
https://doi.org/10.3390/electronics13010203
Chicago/Turabian Style
Deng, Liting, Te Li, Zhenfu Wang, Pu Zhang, Shunhua Wu, Jiachen Liu, Junyue Zhang, Lang Chen, Jiachen Zhang, Weizhou Huang,
and et al. 2024. "Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages" Electronics 13, no. 1: 203.
https://doi.org/10.3390/electronics13010203
APA Style
Deng, L., Li, T., Wang, Z., Zhang, P., Wu, S., Liu, J., Zhang, J., Chen, L., Zhang, J., Huang, W., & Zhang, R.
(2024). Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages. Electronics, 13(1), 203.
https://doi.org/10.3390/electronics13010203
