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Journal: Electronics, 2023
Volume: 12
Number: 2033
Article:
Thermal Performance of Cu Electroplated GaN/AlGaN High-Electron-Mobility Transistors with Various-Thickness Si Substrates
Authors:
by
Ray-Hua Horng, Hsiao-Yun Yeh and Niall Tumilty
Link:
https://www.mdpi.com/2079-9292/12/9/2033
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