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Journal: Electronics, 2022
Volume: 11
Number: 849
Article:
Die-Level Thinning for Flip-Chip Integration on Flexible Substrates
Authors:
by
Muhammad Hassan Malik, Andreas Tsiamis, Hubert Zangl, Alfred Binder, Srinjoy Mitra and Ali Roshanghias
Link:
https://www.mdpi.com/2079-9292/11/6/849
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