Die-Level Thinning for Flip-Chip Integration on Flexible Substrates
Malik, M.H.; Tsiamis, A.; Zangl, H.; Binder, A.; Mitra, S.; Roshanghias, A. Die-Level Thinning for Flip-Chip Integration on Flexible Substrates. Electronics 2022, 11, 849. https://doi.org/10.3390/electronics11060849
Malik MH, Tsiamis A, Zangl H, Binder A, Mitra S, Roshanghias A. Die-Level Thinning for Flip-Chip Integration on Flexible Substrates. Electronics. 2022; 11(6):849. https://doi.org/10.3390/electronics11060849
Chicago/Turabian StyleMalik, Muhammad H., Andreas Tsiamis, Hubert Zangl, Alfred Binder, Srinjoy Mitra, and Ali Roshanghias. 2022. "Die-Level Thinning for Flip-Chip Integration on Flexible Substrates" Electronics 11, no. 6: 849. https://doi.org/10.3390/electronics11060849