Malik, M.H.; Tsiamis, A.; Zangl, H.; Binder, A.; Mitra, S.; Roshanghias, A.
Die-Level Thinning for Flip-Chip Integration on Flexible Substrates. Electronics 2022, 11, 849.
https://doi.org/10.3390/electronics11060849
AMA Style
Malik MH, Tsiamis A, Zangl H, Binder A, Mitra S, Roshanghias A.
Die-Level Thinning for Flip-Chip Integration on Flexible Substrates. Electronics. 2022; 11(6):849.
https://doi.org/10.3390/electronics11060849
Chicago/Turabian Style
Malik, Muhammad Hassan, Andreas Tsiamis, Hubert Zangl, Alfred Binder, Srinjoy Mitra, and Ali Roshanghias.
2022. "Die-Level Thinning for Flip-Chip Integration on Flexible Substrates" Electronics 11, no. 6: 849.
https://doi.org/10.3390/electronics11060849
APA Style
Malik, M. H., Tsiamis, A., Zangl, H., Binder, A., Mitra, S., & Roshanghias, A.
(2022). Die-Level Thinning for Flip-Chip Integration on Flexible Substrates. Electronics, 11(6), 849.
https://doi.org/10.3390/electronics11060849