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Luo X, Huang Z, Wang S, Xiao M, Meng Y, Yan H, Li Q, Wang G. Simulation of TSV Protrusion in 3DIC Integration by Directly Loading on Coarse-Grained Phase-Field Crystal Model. Electronics. 2022; 11(2):221. https://doi.org/10.3390/electronics11020221

Luo, Xiaoting, Zhiheng Huang, Shuanjin Wang, Min Xiao, Yuezhong Meng, Hui Yan, Qizhuo Li, and Gang Wang. 2022. "Simulation of TSV Protrusion in 3DIC Integration by Directly Loading on Coarse-Grained Phase-Field Crystal Model" Electronics 11, no. 2: 221. https://doi.org/10.3390/electronics11020221

Luo, X., Huang, Z., Wang, S., Xiao, M., Meng, Y., Yan, H., Li, Q., & Wang, G. (2022). Simulation of TSV Protrusion in 3DIC Integration by Directly Loading on Coarse-Grained Phase-Field Crystal Model. Electronics, 11(2), 221. https://doi.org/10.3390/electronics11020221