Article Versions Notes

Zhou S, Lin Z, Qiu B, Wang H, Xiong J, He C, Zhou B, Pan Y, Huang R, Bao Y, et al. Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock. Electronics. 2022; 11(16):2556. https://doi.org/10.3390/electronics11162556

Zhou, Shuai, Zhenpei Lin, Baojun Qiu, Han Wang, Jingang Xiong, Chang He, Bei Zhou, Yiliang Pan, Renbin Huang, Yiliang Bao, and et al. 2022. "Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock" Electronics 11, no. 16: 2556. https://doi.org/10.3390/electronics11162556

Zhou, S., Lin, Z., Qiu, B., Wang, H., Xiong, J., He, C., Zhou, B., Pan, Y., Huang, R., Bao, Y., & Cai, N. (2022). Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock. Electronics, 11(16), 2556. https://doi.org/10.3390/electronics11162556