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Journal: Electronics, 2021
Volume: 10
Number: 1930

Article: Multi-Tier 3D IC Physical Design with Analytical Quadratic Partitioning Algorithm Using 2D P&R Tool
Authors: by Azwad Tamir, Milad Salem, Jie Lin, Qutaiba Alasad and Jiann-shiun Yuan
Link: https://www.mdpi.com/2079-9292/10/16/1930

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