Ganguly, A.; Ahmed, M.M.; Singh Narde, R.; Vashist, A.; Shamim, M.S.; Mansoor, N.; Shinde, T.; Subramaniam, S.; Saxena, S.; Venkataraman, J.;
et al. The Advances, Challenges and Future Possibilities of Millimeter-Wave Chip-to-Chip Interconnections for Multi-Chip Systems. J. Low Power Electron. Appl. 2018, 8, 5.
https://doi.org/10.3390/jlpea8010005
AMA Style
Ganguly A, Ahmed MM, Singh Narde R, Vashist A, Shamim MS, Mansoor N, Shinde T, Subramaniam S, Saxena S, Venkataraman J,
et al. The Advances, Challenges and Future Possibilities of Millimeter-Wave Chip-to-Chip Interconnections for Multi-Chip Systems. Journal of Low Power Electronics and Applications. 2018; 8(1):5.
https://doi.org/10.3390/jlpea8010005
Chicago/Turabian Style
Ganguly, Amlan, M. Meraj Ahmed, Rounak Singh Narde, Abhishek Vashist, Md Shahriar Shamim, Naseef Mansoor, Tanmay Shinde, Suryanarayanan Subramaniam, Sagar Saxena, Jayanti Venkataraman,
and et al. 2018. "The Advances, Challenges and Future Possibilities of Millimeter-Wave Chip-to-Chip Interconnections for Multi-Chip Systems" Journal of Low Power Electronics and Applications 8, no. 1: 5.
https://doi.org/10.3390/jlpea8010005
APA Style
Ganguly, A., Ahmed, M. M., Singh Narde, R., Vashist, A., Shamim, M. S., Mansoor, N., Shinde, T., Subramaniam, S., Saxena, S., Venkataraman, J., & Indovina, M.
(2018). The Advances, Challenges and Future Possibilities of Millimeter-Wave Chip-to-Chip Interconnections for Multi-Chip Systems. Journal of Low Power Electronics and Applications, 8(1), 5.
https://doi.org/10.3390/jlpea8010005