Wang, L.; Guo, X.; Dong, S.; Qiao, Y.; Chen, J.; Yan, Z.; Shu, R.; Jin, L.
Effect of Carbon-Doped Cu(Ni) Alloy Film for Barrierless Copper Interconnect. Coatings 2024, 14, 68.
https://doi.org/10.3390/coatings14010068
AMA Style
Wang L, Guo X, Dong S, Qiao Y, Chen J, Yan Z, Shu R, Jin L.
Effect of Carbon-Doped Cu(Ni) Alloy Film for Barrierless Copper Interconnect. Coatings. 2024; 14(1):68.
https://doi.org/10.3390/coatings14010068
Chicago/Turabian Style
Wang, Lei, Xu Guo, Songtao Dong, Yanxin Qiao, Jian Chen, Zhen Yan, Rong Shu, and Lei Jin.
2024. "Effect of Carbon-Doped Cu(Ni) Alloy Film for Barrierless Copper Interconnect" Coatings 14, no. 1: 68.
https://doi.org/10.3390/coatings14010068
APA Style
Wang, L., Guo, X., Dong, S., Qiao, Y., Chen, J., Yan, Z., Shu, R., & Jin, L.
(2024). Effect of Carbon-Doped Cu(Ni) Alloy Film for Barrierless Copper Interconnect. Coatings, 14(1), 68.
https://doi.org/10.3390/coatings14010068