Article Versions Notes

Yun S-D, Kim Y, Lee J-S, Noh J-P, Kim B-S, Kwon J-S, Choi S-W, Yang J-H. Aluminum Co-Deposition via DC Magnetron Sputtering for Enhanced Pitting Resistance of Copper–Nickel Alloys. Coatings. 2024; 14(1):132. https://doi.org/10.3390/coatings14010132

Yun, Sang-Du, Yeonwon Kim, Jun-Seok Lee, Jung-Pil Noh, Beom-Soo Kim, Jae-Sung Kwon, Sung-Woong Choi, and Jeong-Hyeon Yang. 2024. "Aluminum Co-Deposition via DC Magnetron Sputtering for Enhanced Pitting Resistance of Copper–Nickel Alloys" Coatings 14, no. 1: 132. https://doi.org/10.3390/coatings14010132

Yun, S.-D., Kim, Y., Lee, J.-S., Noh, J.-P., Kim, B.-S., Kwon, J.-S., Choi, S.-W., & Yang, J.-H. (2024). Aluminum Co-Deposition via DC Magnetron Sputtering for Enhanced Pitting Resistance of Copper–Nickel Alloys. Coatings, 14(1), 132. https://doi.org/10.3390/coatings14010132