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Journal: Applied SciencesVolume: 9Number: 1962
Article: Preparation and Characterization of High Thermal Conductivity and Low CTE Polyimide Composite Reinforced with Diamond Nanoparticles/SiC Whiskers for 3D IC Interposer RDL Dielectric
  • Authors:
  • Jiangbo Luo1,
  • Yongpeng Wu1 and
  • Yunna Sun1
  • et al.
Link: https://www.mdpi.com/2076-3417/9/9/1962

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