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Journal: Applied SciencesVolume: 9Number: 529
Article: Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders for Power Electronics
- Authors:
- Sri Harini Rajendran1,
- Jung Do Hyun1,2 and
- Jeon Wook Sang1
- et al.
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