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Journal: Appl. Sci., 2019
Volume: 9
Number: 529

Article: Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders for Power Electronics
Authors: by Sri Harini Rajendran, Jung Do Hyun, Jeon Wook Sang and Jung Jae Pil
Link: https://www.mdpi.com/2076-3417/9/3/529

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