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Journal: Appl. Sci., 2019
Volume: 9
Number: 529
Article:
Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders for Power Electronics
Authors:
by
Sri Harini Rajendran, Jung Do Hyun, Jeon Wook Sang and Jung Jae Pil
Link:
https://www.mdpi.com/2076-3417/9/3/529
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