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Appl. Sci. 2019, 9(3), 529; https://doi.org/10.3390/app9030529

Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders for Power Electronics

1
Department of Materials Science and Engineering, University of Seoul, Seoul 130-743, Korea
2
Lightweight Materials Technology Center, Gyeongbuk Technopark, Yeongju, Korea
*
Author to whom correspondence should be addressed.
Received: 31 December 2018 / Revised: 28 January 2019 / Accepted: 31 January 2019 / Published: 4 February 2019
(This article belongs to the Special Issue Selected Papers from the NMJ2018)
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Abstract

In this paper, a novel transient liquid phase bonding material was fabricated by consequent electroless plating of Cu and Sn on a multi-walled carbon nanotube (MWCNT). The resulting Sn-Cu-MWCNT composites were used to join the Cu interconnects at 260°C. After 8 min of reflow time, a complete transformation of Cu3Sn intermetallic compound (IMC) occurred, leaving a Cu/MWCNT-Cu3Sn /Cu joint capable of withstanding the high operating temperature. Due to flake-like morphology, the Sn-Cu-MWCNT composite particles were well packed with lesser voids. The shear strength of the Cu/Cu3Sn-MWCNT/Cu joint was measured as 35.3 MPa, thus exhibiting the scope for replacing conventional transient liquid phase (TLP) powders in the future. View Full-Text
Keywords: Transient liquid phase (TLP) bonding; Cu3Sn-multi-walled carbon nanotube; shear test Transient liquid phase (TLP) bonding; Cu3Sn-multi-walled carbon nanotube; shear test
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Rajendran, S.H.; Do Hyun, J.; Wook Sang, J.; Jae Pil, J. Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders for Power Electronics. Appl. Sci. 2019, 9, 529.

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