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Journal: Appl. Sci., 2025
Volume: 15
Number: 4668
Article:
Evaluation of Leakage Currents of Semiconductor Packages Due to High-Voltage Stress Under an Immersion Cooling Environment
Authors:
by
Kyuhae Min, Taejun Kang, Tae Yeob Kang and Jae-Bum Pyo
Link:
https://www.mdpi.com/2076-3417/15/9/4668
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