Zhang, Q.; Li, S.; Liu, J.; Wang, Y.; Zhang, B.; Zhang, L.-Y.
Study of a Bimetallic Interfacial Bonding Process Based on Ultrasonic Quantitative Evaluation. Metals 2018, 8, 329.
https://doi.org/10.3390/met8050329
AMA Style
Zhang Q, Li S, Liu J, Wang Y, Zhang B, Zhang L-Y.
Study of a Bimetallic Interfacial Bonding Process Based on Ultrasonic Quantitative Evaluation. Metals. 2018; 8(5):329.
https://doi.org/10.3390/met8050329
Chicago/Turabian Style
Zhang, Qingdong, Shuo Li, Jiyang Liu, Yanan Wang, Boyang Zhang, and Li-Yuan Zhang.
2018. "Study of a Bimetallic Interfacial Bonding Process Based on Ultrasonic Quantitative Evaluation" Metals 8, no. 5: 329.
https://doi.org/10.3390/met8050329
APA Style
Zhang, Q., Li, S., Liu, J., Wang, Y., Zhang, B., & Zhang, L.-Y.
(2018). Study of a Bimetallic Interfacial Bonding Process Based on Ultrasonic Quantitative Evaluation. Metals, 8(5), 329.
https://doi.org/10.3390/met8050329