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Journal: Metals, 2017
Volume: 7
Number: 540

Article: The Effect of Eutectic Structure on the Creep Properties of Sn-3.0Ag-0.5Cu and Sn-8.0Sb-3.0Ag Solders
Authors: by Yujin Park, Jung-Hwan Bang, Chul Min Oh, Won Sik Hong and Namhyun Kang
Link: https://www.mdpi.com/2075-4701/7/12/540

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