Lv, X.; Pan, Z.; Liu, Y.; Zhang, C.; Wang, Z.; Sun, F.
Effects of Bi and In Addition on Microstructure and Properties of Sn-0.7Cu Solder. Metals 2025, 15, 157.
https://doi.org/10.3390/met15020157
AMA Style
Lv X, Pan Z, Liu Y, Zhang C, Wang Z, Sun F.
Effects of Bi and In Addition on Microstructure and Properties of Sn-0.7Cu Solder. Metals. 2025; 15(2):157.
https://doi.org/10.3390/met15020157
Chicago/Turabian Style
Lv, Xiaochun, Zhen Pan, Yang Liu, Chenghao Zhang, Zhiyuan Wang, and Fenglian Sun.
2025. "Effects of Bi and In Addition on Microstructure and Properties of Sn-0.7Cu Solder" Metals 15, no. 2: 157.
https://doi.org/10.3390/met15020157
APA Style
Lv, X., Pan, Z., Liu, Y., Zhang, C., Wang, Z., & Sun, F.
(2025). Effects of Bi and In Addition on Microstructure and Properties of Sn-0.7Cu Solder. Metals, 15(2), 157.
https://doi.org/10.3390/met15020157