Leal, J.R.d.S.; Reyes, R.A.V.; Gouveia, G.L.d.; Coury, F.G.; Spinelli, J.E.
Evaluation of Solidification and Interfacial Reaction of Sn-Bi and Sn-Bi-In Solder Alloys in Copper and Nickel Interfaces. Metals 2024, 14, 963.
https://doi.org/10.3390/met14090963
AMA Style
Leal JRdS, Reyes RAV, Gouveia GLd, Coury FG, Spinelli JE.
Evaluation of Solidification and Interfacial Reaction of Sn-Bi and Sn-Bi-In Solder Alloys in Copper and Nickel Interfaces. Metals. 2024; 14(9):963.
https://doi.org/10.3390/met14090963
Chicago/Turabian Style
Leal, Jaderson Rodrigo da Silva, Rodrigo André Valenzuela Reyes, Guilherme Lisboa de Gouveia, Francisco Gil Coury, and José Eduardo Spinelli.
2024. "Evaluation of Solidification and Interfacial Reaction of Sn-Bi and Sn-Bi-In Solder Alloys in Copper and Nickel Interfaces" Metals 14, no. 9: 963.
https://doi.org/10.3390/met14090963
APA Style
Leal, J. R. d. S., Reyes, R. A. V., Gouveia, G. L. d., Coury, F. G., & Spinelli, J. E.
(2024). Evaluation of Solidification and Interfacial Reaction of Sn-Bi and Sn-Bi-In Solder Alloys in Copper and Nickel Interfaces. Metals, 14(9), 963.
https://doi.org/10.3390/met14090963