Laksono, A.D.; Tsai, T.-Y.; Chung, T.-H.; Chang, Y.-C.; Yen, Y.-W.
Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates. Metals 2023, 13, 12.
https://doi.org/10.3390/met13010012
AMA Style
Laksono AD, Tsai T-Y, Chung T-H, Chang Y-C, Yen Y-W.
Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates. Metals. 2023; 13(1):12.
https://doi.org/10.3390/met13010012
Chicago/Turabian Style
Laksono, Andromeda Dwi, Tzu-Yang Tsai, Tai-Hsuan Chung, Yong-Chi Chang, and Yee-Wen Yen.
2023. "Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates" Metals 13, no. 1: 12.
https://doi.org/10.3390/met13010012
APA Style
Laksono, A. D., Tsai, T.-Y., Chung, T.-H., Chang, Y.-C., & Yen, Y.-W.
(2023). Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates. Metals, 13(1), 12.
https://doi.org/10.3390/met13010012