Dušek, K.; Bušek, D.; Veselý, P.; Pražanová, A.; Plaček, M.; Re, J.D.
Understanding the Effect of Reflow Profile on the Metallurgical Properties of Tin–Bismuth Solders. Metals 2022, 12, 121.
https://doi.org/10.3390/met12010121
AMA Style
Dušek K, Bušek D, Veselý P, Pražanová A, Plaček M, Re JD.
Understanding the Effect of Reflow Profile on the Metallurgical Properties of Tin–Bismuth Solders. Metals. 2022; 12(1):121.
https://doi.org/10.3390/met12010121
Chicago/Turabian Style
Dušek, Karel, David Bušek, Petr Veselý, Anna Pražanová, Martin Plaček, and Julia Del Re.
2022. "Understanding the Effect of Reflow Profile on the Metallurgical Properties of Tin–Bismuth Solders" Metals 12, no. 1: 121.
https://doi.org/10.3390/met12010121
APA Style
Dušek, K., Bušek, D., Veselý, P., Pražanová, A., Plaček, M., & Re, J. D.
(2022). Understanding the Effect of Reflow Profile on the Metallurgical Properties of Tin–Bismuth Solders. Metals, 12(1), 121.
https://doi.org/10.3390/met12010121