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Journal: Metals, 2021
Volume: 11
Number: 210
Article:
Nucleation and Morphology of Cu6Sn5 Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate
Authors:
by
Junhyuk Son, Dong-Yurl Yu, Min-Su Kim, Yong-Ho Ko, Dong-Jin Byun and Junghwan Bang
Link:
https://www.mdpi.com/2075-4701/11/2/210
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