Sharma, V.B.; Tewari, S.; Biswas, S.; Lohani, B.; Dwivedi, U.D.; Dwivedi, D.; Sharma, A.; Jung, J.P.
Recent Advancements in AI-Enabled Smart Electronics Packaging for Structural Health Monitoring. Metals 2021, 11, 1537.
https://doi.org/10.3390/met11101537
AMA Style
Sharma VB, Tewari S, Biswas S, Lohani B, Dwivedi UD, Dwivedi D, Sharma A, Jung JP.
Recent Advancements in AI-Enabled Smart Electronics Packaging for Structural Health Monitoring. Metals. 2021; 11(10):1537.
https://doi.org/10.3390/met11101537
Chicago/Turabian Style
Sharma, Vinamra Bhushan, Saurabh Tewari, Susham Biswas, Bharat Lohani, Umakant Dhar Dwivedi, Deepak Dwivedi, Ashutosh Sharma, and Jae Pil Jung.
2021. "Recent Advancements in AI-Enabled Smart Electronics Packaging for Structural Health Monitoring" Metals 11, no. 10: 1537.
https://doi.org/10.3390/met11101537
APA Style
Sharma, V. B., Tewari, S., Biswas, S., Lohani, B., Dwivedi, U. D., Dwivedi, D., Sharma, A., & Jung, J. P.
(2021). Recent Advancements in AI-Enabled Smart Electronics Packaging for Structural Health Monitoring. Metals, 11(10), 1537.
https://doi.org/10.3390/met11101537