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Open AccessArticle

Production of Surface Layer with Gradient Microstructure and Microhardess on Copper by High Pressure Surface Rolling

1
School of Mechanical Engineering, Wuhan Polytechnic University, Wuhan 430023, China
2
School of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, China
*
Author to whom correspondence should be addressed.
Metals 2020, 10(1), 73; https://doi.org/10.3390/met10010073
Received: 18 November 2019 / Revised: 26 December 2019 / Accepted: 27 December 2019 / Published: 2 January 2020
(This article belongs to the Special Issue Strengthening Mechanisms in Metallic Materials)
Pure copper was subjected to high-pressure surface rolling (HPSR) to obtain a surface gradient layer. Effects of HPSR parameters on the surface microstructure and microhardness of Cu were investigated by using optical microscopy, transmission electronic microscopy, X-ray diffraction, and the microhardness test. The HPSR surface layer has a gradient microstructure consisting of increasingly refined grains with decreasing depth from the treated surface (DFS). The thicknesses of the refined surface layer can be up to ~1.8 mm, and the grain size of the topmost surface is down to ~88 nm, depending on the HPSR parameters including pressure, time, and temperature. Microhardness of HPSR samples increases with decreasing DFS, with a maximum of ~2.4 times that of the undeformed matrix. The present results indicated that HPSR could be an effective method for the production of a mm-thick surface layer on Cu with gradient microstructure and property. View Full-Text
Keywords: high-pressure surface rolling; copper; grain refinement; microhardness high-pressure surface rolling; copper; grain refinement; microhardness
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MDPI and ACS Style

Li, J.; Mei, Q.; Li, Y.; Wang, B. Production of Surface Layer with Gradient Microstructure and Microhardess on Copper by High Pressure Surface Rolling. Metals 2020, 10, 73.

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