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Journal: Polymers, 2025
Volume: 17
Number: 1126
Article:
Mitigation of Sink Voids in Thick-Walled Thermoplastic Components via Integrated Taguchi DOE and CAE Simulations
Authors:
by
Feng Wang, Wenbo Luo, Jiling Bu, Bo Zou and Xingwu Ding
Link:
https://www.mdpi.com/2073-4360/17/8/1126
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