Hu, S.; Wang, D.; Venkataraman, M.; Militký, J.; Křemenáková, D.; Palušák, M.
Sweat-Resistant Parylene-C Encapsulated Conductive Textiles for Active Thermal Management. Polymers 2025, 17, 2952.
https://doi.org/10.3390/polym17212952
AMA Style
Hu S, Wang D, Venkataraman M, Militký J, Křemenáková D, Palušák M.
Sweat-Resistant Parylene-C Encapsulated Conductive Textiles for Active Thermal Management. Polymers. 2025; 17(21):2952.
https://doi.org/10.3390/polym17212952
Chicago/Turabian Style
Hu, Shi, Dan Wang, Mohanapriya Venkataraman, Jiřà Militký, Dana Křemenáková, and Martin Palušák.
2025. "Sweat-Resistant Parylene-C Encapsulated Conductive Textiles for Active Thermal Management" Polymers 17, no. 21: 2952.
https://doi.org/10.3390/polym17212952
APA Style
Hu, S., Wang, D., Venkataraman, M., Militký, J., Křemenáková, D., & Palušák, M.
(2025). Sweat-Resistant Parylene-C Encapsulated Conductive Textiles for Active Thermal Management. Polymers, 17(21), 2952.
https://doi.org/10.3390/polym17212952