Morais, P.; Akhavan-Safar, A.; Carbas, R.J.C.; Marques, E.A.S.; Karunamurthy, B.; da Silva, L.F.M.
Mode I Fatigue and Fracture Assessment of Polyimide–Epoxy and Silicon–Epoxy Interfaces in Chip-Package Components. Polymers 2024, 16, 463.
https://doi.org/10.3390/polym16040463
AMA Style
Morais P, Akhavan-Safar A, Carbas RJC, Marques EAS, Karunamurthy B, da Silva LFM.
Mode I Fatigue and Fracture Assessment of Polyimide–Epoxy and Silicon–Epoxy Interfaces in Chip-Package Components. Polymers. 2024; 16(4):463.
https://doi.org/10.3390/polym16040463
Chicago/Turabian Style
Morais, Pedro, Alireza Akhavan-Safar, Ricardo J. C. Carbas, Eduardo A. S. Marques, Bala Karunamurthy, and Lucas F. M. da Silva.
2024. "Mode I Fatigue and Fracture Assessment of Polyimide–Epoxy and Silicon–Epoxy Interfaces in Chip-Package Components" Polymers 16, no. 4: 463.
https://doi.org/10.3390/polym16040463
APA Style
Morais, P., Akhavan-Safar, A., Carbas, R. J. C., Marques, E. A. S., Karunamurthy, B., & da Silva, L. F. M.
(2024). Mode I Fatigue and Fracture Assessment of Polyimide–Epoxy and Silicon–Epoxy Interfaces in Chip-Package Components. Polymers, 16(4), 463.
https://doi.org/10.3390/polym16040463