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Journal: Polymers, 2023
Volume: 15
Number: 3708
Article:
Organosilicon Compounds in Hot-Melt Adhesive Technologies
Authors:
by
Jakub Czakaj, Bogna Sztorch, Eliza Romanczuk-Ruszuk, Dariusz BrzÄ…kalski and Robert E. Przekop
Link:
https://www.mdpi.com/2073-4360/15/18/3708
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