Yang, H.; Chen, Q.; Wang, X.; Chi, M.; Liu, H.; Ning, X.
Dielectric and Thermal Conductivity of Epoxy Resin Impregnated Nano-h-BN Modified Insulating Paper. Polymers 2019, 11, 1359.
https://doi.org/10.3390/polym11081359
AMA Style
Yang H, Chen Q, Wang X, Chi M, Liu H, Ning X.
Dielectric and Thermal Conductivity of Epoxy Resin Impregnated Nano-h-BN Modified Insulating Paper. Polymers. 2019; 11(8):1359.
https://doi.org/10.3390/polym11081359
Chicago/Turabian Style
Yang, Hongda, Qingguo Chen, Xinyu Wang, Minghe Chi, Heqian Liu, and Xin Ning.
2019. "Dielectric and Thermal Conductivity of Epoxy Resin Impregnated Nano-h-BN Modified Insulating Paper" Polymers 11, no. 8: 1359.
https://doi.org/10.3390/polym11081359
APA Style
Yang, H., Chen, Q., Wang, X., Chi, M., Liu, H., & Ning, X.
(2019). Dielectric and Thermal Conductivity of Epoxy Resin Impregnated Nano-h-BN Modified Insulating Paper. Polymers, 11(8), 1359.
https://doi.org/10.3390/polym11081359