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Open AccessArticle

Dielectric and Thermal Conductivity of Epoxy Resin Impregnated Nano-h-BN Modified Insulating Paper

1,2, 1,2,*, 1,2,*, 1,2, 3 and 1,2
1
Heilongjiang Provincial Key Laboratory of Dielectric Engineering, School of Electrical and Electronic Engineering, Harbin University of Science and Technology, Harbin 150080, China
2
Key Laboratory of Engineering Dielectrics and Its Application, Ministry of Education, Harbin University of Science and Technology, Harbin 150080, China
3
State Grid Heilongjiang Electric Power Company Limited Electric Power Research Institute, Harbin 150030, China
*
Authors to whom correspondence should be addressed.
Polymers 2019, 11(8), 1359; https://doi.org/10.3390/polym11081359
Received: 10 July 2019 / Revised: 5 August 2019 / Accepted: 14 August 2019 / Published: 16 August 2019
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PDF [8867 KB, uploaded 16 August 2019]
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Abstract

Epoxy resin-impregnated insulation paper (RIP) composites are used as the inner insulation of dry condenser bushing in the ultra-high voltage direct current (UHVDC) power transmission system. To improve the dielectric properties and heat conductivity of RIP, hexagonal boron nitride (h-BN) nano-flakes are added to the insulation paper at concentrations of 0–50 wt % before impregnation with pure epoxy resin. X-ray diffraction (XRD), scanning electron microscopy (SEM) observations, thermal conductivity as well as the typical dielectric properties of direct current (DC) volume conductivity. DC breakdown strength and space charge characteristics were obtained. The maximum of nano-h-BN modified heat conductivity reach 0.478 W/(m·K), increased by 139% compared with unmodified RIP. The DC breakdown electric field strength of the nano-h-BN modified RIP does not reduce much. The conductivity of nano-h-BN modified is less sensitive to temperature. As well, the space charge is suppressed when the content is 50 wt %. Therefore, the nano-h-BN modified RIP is potentially useful in practical dry DC bushing application. View Full-Text
Keywords: dry bushing; epoxy resin-impregnated paper; dielectric characteristics; thermal conductivity; space charge; nanocomposite dry bushing; epoxy resin-impregnated paper; dielectric characteristics; thermal conductivity; space charge; nanocomposite
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Yang, H.; Chen, Q.; Wang, X.; Chi, M.; Liu, H.; Ning, X. Dielectric and Thermal Conductivity of Epoxy Resin Impregnated Nano-h-BN Modified Insulating Paper. Polymers 2019, 11, 1359.

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