Article Versions Notes

Pan C-T, Wang S-Y, Yen C-K, Ho C-K, Yen J-F, Chen S-W, Fu F-R, Lin Y-T, Lin C-H, Kumar A, et al. Study on Delamination Between Polymer Materials and Metals in IC Packaging Process. Polymers. 2019; 11(6):940. https://doi.org/10.3390/polym11060940

Pan, Cheng-Tang, Shao-Yu Wang, Chung-Kun Yen, Chien-Kai Ho, Jhan-Foug Yen, Shi-Wei Chen, Fan-Rui Fu, Yi-Tzu Lin, Cing-Hao Lin, Ajay Kumar, and et al. 2019. "Study on Delamination Between Polymer Materials and Metals in IC Packaging Process" Polymers 11, no. 6: 940. https://doi.org/10.3390/polym11060940

Pan, C.-T., Wang, S.-Y., Yen, C.-K., Ho, C.-K., Yen, J.-F., Chen, S.-W., Fu, F.-R., Lin, Y.-T., Lin, C.-H., Kumar, A., & Shiue, Y.-L. (2019). Study on Delamination Between Polymer Materials and Metals in IC Packaging Process. Polymers, 11(6), 940. https://doi.org/10.3390/polym11060940