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Journal: Polymers, 2019
Volume: 11
Number: 557

Article: Molecular Dynamics Simulation on the Effect of Bonding Pressure on Thermal Bonding of Polymer Microfluidic Chip
Authors: by Mingyong Zhou, Xiang Xiong, Dietmar Drummer and Bingyan Jiang
Link: https://www.mdpi.com/2073-4360/11/3/557

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