Mai, V.-D.; Shin, S.-R.; Lee, D.-S.; Kang, I.
Thermal Healing, Reshaping and Ecofriendly Recycling of Epoxy Resin Crosslinked with Schiff Base of Vanillin and Hexane-1,6-Diamine. Polymers 2019, 11, 293.
https://doi.org/10.3390/polym11020293
AMA Style
Mai V-D, Shin S-R, Lee D-S, Kang I.
Thermal Healing, Reshaping and Ecofriendly Recycling of Epoxy Resin Crosslinked with Schiff Base of Vanillin and Hexane-1,6-Diamine. Polymers. 2019; 11(2):293.
https://doi.org/10.3390/polym11020293
Chicago/Turabian Style
Mai, Van-Dung, Se-Ra Shin, Dai-Soo Lee, and Ilho Kang.
2019. "Thermal Healing, Reshaping and Ecofriendly Recycling of Epoxy Resin Crosslinked with Schiff Base of Vanillin and Hexane-1,6-Diamine" Polymers 11, no. 2: 293.
https://doi.org/10.3390/polym11020293
APA Style
Mai, V.-D., Shin, S.-R., Lee, D.-S., & Kang, I.
(2019). Thermal Healing, Reshaping and Ecofriendly Recycling of Epoxy Resin Crosslinked with Schiff Base of Vanillin and Hexane-1,6-Diamine. Polymers, 11(2), 293.
https://doi.org/10.3390/polym11020293