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Journal: Polymers, 2019
Volume: 11
Number: 56
56
Article: Mechanically Enhanced Electrical Conductivity of Polydimethylsiloxane-Based Composites by a Hot Embossing Process
Authors: by Xiaolong Gao, Yao Huang, Xiaoxiang He, Xiaojing Fan, Ying Liu, Hong Xu, Daming Wu and Chaoying Wan
Link: https://www.mdpi.com/2073-4360/11/1/56

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