Order Article Reprints

Lin J-A, Lin C-K, Liu C-M, Huang Y-S, Chen C, Chu DT, Tu K-N. Formation Mechanism of Porous Cu₃Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints. Crystals. 2016; 6(1):12. https://doi.org/10.3390/cryst6010012

Lin, Jie-An, Chung-Kuang Lin, Chen-Min Liu, Yi-Sa Huang, Chih Chen, David T. Chu, and King-Ning Tu. 2016. "Formation Mechanism of Porous Cu₃Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints" Crystals 6, no. 1: 12. https://doi.org/10.3390/cryst6010012

Lin, J.-A., Lin, C.-K., Liu, C.-M., Huang, Y.-S., Chen, C., Chu, D. T., & Tu, K.-N. (2016). Formation Mechanism of Porous Cu₃Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints. Crystals, 6(1), 12. https://doi.org/10.3390/cryst6010012