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Journal: CrystalsVolume: 6Number: 12
Article: Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints
- Authors:
- Jie-An Lin1,
- Chung-Kuang Lin1 and
- Chen-Min Liu1
- et al.
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