Niu, T.; Xu, K.; Shen, C.; Sun, T.; Oberst, J.; Handwerker, C.A.; Subbarayan, G.; Wang, H.; Zhang, X.
In Situ Study on Cu-to-Cu Thermal Compression Bonding. Crystals 2023, 13, 989.
https://doi.org/10.3390/cryst13070989
AMA Style
Niu T, Xu K, Shen C, Sun T, Oberst J, Handwerker CA, Subbarayan G, Wang H, Zhang X.
In Situ Study on Cu-to-Cu Thermal Compression Bonding. Crystals. 2023; 13(7):989.
https://doi.org/10.3390/cryst13070989
Chicago/Turabian Style
Niu, Tongjun, Ke Xu, Chao Shen, Tianyi Sun, Justin Oberst, Carol A. Handwerker, Ganesh Subbarayan, Haiyan Wang, and Xinghang Zhang.
2023. "In Situ Study on Cu-to-Cu Thermal Compression Bonding" Crystals 13, no. 7: 989.
https://doi.org/10.3390/cryst13070989
APA Style
Niu, T., Xu, K., Shen, C., Sun, T., Oberst, J., Handwerker, C. A., Subbarayan, G., Wang, H., & Zhang, X.
(2023). In Situ Study on Cu-to-Cu Thermal Compression Bonding. Crystals, 13(7), 989.
https://doi.org/10.3390/cryst13070989