Article Versions Notes

Zhao M, Jian X, Chen S, Chen M, Wang G, Gong T, Tian Y, Lu X, Zhao Z, Yang X. Research on the Mechanical Failure Risk Points of Ti/Cu/Ti/Au Metallization Layer. Crystals. 2023; 13(12):1625. https://doi.org/10.3390/cryst13121625

Zhao, Mingrui, Xiaodong Jian, Si Chen, Minghui Chen, Gang Wang, Tao Gong, Yangning Tian, Xiangjun Lu, Zhenbo Zhao, and Xiaofeng Yang. 2023. "Research on the Mechanical Failure Risk Points of Ti/Cu/Ti/Au Metallization Layer" Crystals 13, no. 12: 1625. https://doi.org/10.3390/cryst13121625

Zhao, M., Jian, X., Chen, S., Chen, M., Wang, G., Gong, T., Tian, Y., Lu, X., Zhao, Z., & Yang, X. (2023). Research on the Mechanical Failure Risk Points of Ti/Cu/Ti/Au Metallization Layer. Crystals, 13(12), 1625. https://doi.org/10.3390/cryst13121625